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RoHS (Pb-Free) Overview
In December 2002, the European Union Parliament approved the content of two directives to better control the management of waste electronic equipment. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous substances (RoHS). The WEEE addresses the collection and treatment requirements of waste electronic equipment for the member countries. The RoHS sets phase-out dates for the use of Lead (Pb) and several other materials contained in electronic products. The RoHS states that the targeted materials shall no longer be contained in the electronic products above certain limits unless there is an exemption provided in the rule.

OnSpec RoHS (Pb-free) Program
The OnSpec RoHS Compliance (Pb-free) program is implemented in accordance with European Union (EU) Legislation titled "Restriction of the use of certain Hazardous Substances (RoHS)" including banning the use of Lead (Pb) in electronic assemblies after July 1, 2006.

OnSpec Definitions
RoHS Compliance Classification: Component and Assembly shall be compliant to Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. These materials include Lead (Pb), mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).

RoHS Compliance Exemptions: Article 4, paragraph 1 of the RoHS directive references the restriction of the use of certain hazardous substances. Paragraph 2 of the directive references exemptions to these substances. Those exemptions applicable to OnSpec product are referenced in the paragraphs 5, 6, and 7 in the ANNEX Section as follows:

Lead (Pb) in glass of cathode ray tubes, electronic components and fluorescent tubes.
Lead (Pb) as an alloying element in steel containing up to 0.35% Lead (Pb) by weight, aluminum containing up to 0.4 % Lead (Pb) by weight and as a copper alloy containing up to 4% Lead (Pb) by weight.
Lead (Pb) in high melting temperature type solders (i.e. Tin-Lead (SnPb) solder alloys containing more than 85% Lead (Pb)).

Pb-Free Classification: Component and Assembly Lead (Pb) content shall be less than 0.1% by weight of the device, shall not be intentionally introduced, and shall be a homogeneous material that can not be mechanically disjoined into different materials.

Components: OnSpec's definition of components apply to quartz crystal devices

Assemblies: OnSpec's definition of assemblies apply to oscillator devices (XO, VCXO, TCXO, and OCXO's)
Solder Composition

Part Number Identification
When applicable, the OnSpec specification sheet shall indicate if the device is classified as RoHS Compliant or RoHS Compliant (Pb-free).

Process Compatibility
The OnSpec specification sheet identifies the suggested solder reflow profile(s). All OnSpec RoHS Compliant and RoHS Compliant (Pb-free) products are backwards compatible to lower temperature Tin-Lead (SnPb) reflow profile(s).

Marking and Labeling
OnSpec has a Pb-free labeling method for the packaging of all RoHS Compliant and RoHS Compliant (Pb-free) products. The lowest level shipping container shall identify the products as Pb-free.

RoHS Compliant and RoHS Compliant (Pb-Free) 260°C Solder Reflow Profile
OnSpec RoHS Compliant and RoHS Compliant (Pb-Free) products shall be capable of withstanding the following solder reflow profile:
SMD Components and Assemblies Reflow Methods
Infrared/Convection Reflow (per IPC/JEDEC J-STD-020)
Average ramp-up rate of 3°C/second maximum
Pre-heat from 150°C to 200°C, 60 to 180 seconds
Time maintained above a reflow temperature of 217°C, 60 to 150 seconds
Target Peak Temperature of 250°C +0/-5°C, 20 to 40 seconds
Peak Temperature of 260°C maximum for 10 seconds maximum
Average ramp-down rate of 6°C/second maximum
Time from 25°C to Peak Temperature, 8 minutes maximum(One time)

Manual Solder Reflow
Target Peak Temperature of 250°C +0/-5°C, 5 to 10 seconds
Peak Temperature of 260°C maximum for 10 seconds maximum
Through-hole Components and Assemblies Reflow Methods
Wave Solder (Back of board Solder Bath Reflow)
Pre-heat from 150°C to 200°C, 60 to 180 seconds
Peak Temperature of 260°C maximum for 10 seconds maximum (one time)
Manual Solder Reflow
Target Peak Temperature of 250°C +0/-5°C, 5 to 10 seconds
Peak Temperature of 260°C maximum for 10 seconds maximum

These are the oscillators that are RoHS compliant.

	OnSpec Oscillators Limited, Unit 10 Alliance Close, Attleborough Fields Industrial Estate, Nuneaton, Warwickshire, CV11 6SD, ENGLAND. Tel: +44 (0) 24 76642024 Fax: +44 (0) 24 76642073 E-mail: sales@onspec.co.uk